Latest
industry research report on: Global Semiconductor Packaging Materials
Market | Industry Size, Share, Research, Reviews, Analysis,
Strategies, Demand, Growth, Segmentation, Parameters, Forecasts
The objective of this report is
to define, describe, and forecast the market on the basis of type,
application, medical condition, and region. It provides detailed
information regarding the major factors influencing the growth of the
market. This report also tracks and analyzes competitive developments
of the key players in terms of market developments, product
portfolios, and financials.Acute Renal Failure Market: Industry Size,
Share, Growth, Forecasts.
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Semiconductor
packages are plastic, ceramic, and metal components that are not only
protect fabricated integrated circuits (ICs) on the semiconductor
die, but also act as an interconnect between the printed circuit
board (PCB) and the die during shipping and handling. These packaging
materials safeguard and protect the die from the external mechanical
impacts and corrosion, besides acting as an electrically conductive
interconnection with excellent signal propagation properties.
Excessive heat in the integrated circuit is dissipation through
attached heat spreaders. Semiconductor packaging components vary in
dimensions and functionality and are mainly organic substrates,
bonding wires, encapsulation resins, lead frames, thermal interface
materials, die attach materials, and solder balls. The key customers
of these packaging materials are the electronics industry, automotive
sector, fabless semiconductor companies, packaging material
suppliers, and packaging subcontractors.
Technavios
analysts forecast the global semiconductor packaging materials market
to grow at a CAGR of 5.27% during the period 2017-2021.
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Covered
in this report
The
report covers the present scenario and the growth prospects of the
global semiconductor packaging materials market for 2017-2021. To
calculate the market size, the report considers the revenue generated
by vendors through the sales of semiconductor packaging materials
which are organic substrates, lead frames, bonding wires,
encapsulation resins, die attach materials, solder balls, thermal
interface materials, and WLP dielectrics.
The
market is divided into the following segments based on geography:
Americas
APAC
EMEA
Technavio's
report, Global Semiconductor Packaging Materials Market 2017-2021,
has been prepared based on an in-depth market analysis with inputs
from industry experts. The report covers the market landscape and its
growth prospects over the coming years. The report also includes a
discussion of the key vendors operating in this market.
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Key vendors
Amkor Technology
DuPont
Henkel
Honeywell
Kyocera
Toppan Printing
Other prominent vendors
Hitachi Chemical
ASM Pacific Technology
BASF
Beijing Kehua New Chemical
Technology
Market driver
Increasing miniaturization of
electronic devices and growing application of semiconductor ICs in
IoT
For a full, detailed list, view
our report
Market challenge
Capital-intensive market
For a full, detailed list, view
our report
Market trend
Increase in adoption of
flip-chip, Sip, lead-free packaging solutions
For a full, detailed list, view
our report
Key questions answered in
this report
What will the market size be in
2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to
market growth?
Who are the key vendors in this
market space?
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